发明名称 Adding Symmetrical Filling Material In An Integrated Circuit Layout
摘要 In one embodiment, an integrated circuit has a conductive layer, where the conductive layer has a first set of regions and a second set of fill material regions, and the second set of fill material regions has a line of symmetry. Other embodiments are described and claimed.
申请公布号 US2011042818(A1) 申请公布日期 2011.02.24
申请号 US20090543677 申请日期 2009.08.19
申请人 QUALCOMM INCORPORATED 发明人 LIAO HONGMEI
分类号 H01L23/48;G06F17/50;H01L21/302 主分类号 H01L23/48
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