发明名称 Elektrisch leitfähige Anpassschichten und Verfahren
摘要 Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.
申请公布号 DE102004040474(B4) 申请公布日期 2011.02.24
申请号 DE20041040474 申请日期 2004.08.20
申请人 SIEMENS MEDICAL SOLUTIONS USA INC. 发明人 FREY, GREGG W.;SHELJASKOW, TODOR;WILSER, WALTER T.;WALTERS, WORTH B.;OLIVER, NELSON H.
分类号 H04R17/00;A61B8/00;B06B1/06;B32B3/00;G01N29/28 主分类号 H04R17/00
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