发明名称 LASER MACHINING METHOD AND CHIP
摘要 Disclosed is a laser machining method whereby a workpiece is reliably cut and the strength of a chip obtained is enhanced. Laser light (L) is irradiated on a workpiece (1) to form modified regions (17, 27, 37, 47) which extend along an intended cutting line (5) and are arranged in the thickness direction. The modified region (17) is formed so that modified region forming parts (17a) and modified region non-forming parts (17b) are alternately arranged along the intended cutting line, and the modified region (47) is formed so that modified region forming parts (47a) and modified region non-forming parts (47b) are alternately arranged along the intended cutting line. Thus, it is possible to prevent the strength of a rear surface (21) side and a front surface (3) side of a chip obtained by cutting from being reduced due to the formed modified regions (7). As the modified regions (27, 37) located between the modified regions (17, 47) are formed continuously from one end of the intended cutting line (5) to the other end thereof, the cutting property of the workpiece (1) can be reliably obtained.
申请公布号 WO2011021627(A1) 申请公布日期 2011.02.24
申请号 WO2010JP63879 申请日期 2010.08.17
申请人 HAMAMATSU PHOTONICS K.K.;NAKAGAWA AIKO;SAKAMOTO TAKESHI 发明人 NAKAGAWA AIKO;SAKAMOTO TAKESHI
分类号 B23K26/40;B23K26/00;B23K26/38;H01L21/301 主分类号 B23K26/40
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