发明名称 CURABLE COMPOSITION
摘要 <p>Disclosed is a curable composition which has low viscosity and thus exhibits good workability. The curable composition provides a cured product that has excellent mechanical strength. Specifically disclosed is a curable composition which contains: a curable resin component that contains a polymer (A) which has a polyoxyalkylene chain, a reactive silicon group, and a urethane bond in each molecule; and at least one silicate mineral (X) which is selected from the group consisting of silicate minerals (B) represented by Al2O3·2SiO2·nH2O (wherein n is a number of 0-4) and fired silicate minerals (C) which are obtained by firing the silicate minerals (B) at 350-1,200°C.</p>
申请公布号 WO2011021589(A1) 申请公布日期 2011.02.24
申请号 WO2010JP63780 申请日期 2010.08.13
申请人 ASAHI GLASS COMPANY, LIMITED;HATANAKA, YUKI;SUNAYAMA, YOSHITAKA;TANAKA, HIDEAKI 发明人 HATANAKA, YUKI;SUNAYAMA, YOSHITAKA;TANAKA, HIDEAKI
分类号 C08L71/02;C08K3/34 主分类号 C08L71/02
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