| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve light collection efficiency of a solid-state imaging device using a microlens to focus light onto a light-receiving region with the wiring pattern of the solid-state imaging device. <P>SOLUTION: The solid-state imaging device has a first wiring layer 19 and a second wiring layer 22 each formed in a ring shape so as to trace the outline of the light-receiving region of a photodiode PD, and thereby all of the first wiring layer 19, the second wiring layer 22 and a third wiring layer 25 are arranged to surround an upper part of the photodiode PD. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
