| 摘要 |
PROBLEM TO BE SOLVED: To provide a workpiece holding apparatus for more surely removing electric charges remaining in an electrostatic chuck and a workpiece, a method of controlling the electrostatic chuck, and a method of manufacturing a semiconductor device. SOLUTION: A wafer is mounted on the electrostatic chuck 20, and voltages having the opposite polarities are applied to electrodes 21a, 21b to attract the wafer to the electrostatic chuck 20. After plasma processing on the wafer is completed, application of opposite-polarity voltages, demagnetizing plasma processing, and application of a demagnetizing voltage are carried out in order, and then a lift pin is placed in operation to separate the wafer from the electrostatic chuck 20. When the wafer is separated, ammeters 32a, 32b detect currents flowing through wiring paths 24a, 24b of the electrodes 21a, 21b, and based upon detection results thereof, a control unit 34 determines plasma conditions of demagnetizing plasma processing, and a polarity, a voltage value, and an application time of a demagnetizing voltage for processing on a next wafer. COPYRIGHT: (C)2011,JPO&INPIT |
