发明名称 Packaging system for a floor panel
摘要 A packaging system and a method of packaging a plurality of floor panels in a box includes floor panels having a top layer and a bottom layer. The top layer has a top surface with a visible decorative pattern and a bottom surface adhered to a top surface of the bottom layer such that the bottom layer is offset from the top layer in a direction of length and width and a marginal end portion of the top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed. At least one of the marginal end portions has an adhesive. The floor panels are stacked in the box in pairs. Each of the pairs is stacked such that the top surfaces of the top layers of each of the pairs of the floor panels are facing each other.
申请公布号 US2011042252(A1) 申请公布日期 2011.02.24
申请号 US20100859566 申请日期 2010.08.19
申请人 BALMER RICHARD H;LEE SHIH CHUNG;DAO DUNG V;KNAFELC CHRISTOPHER R;HARRINGTON HEATH E;ANSPACH KEAN M;BUCKWALTER MICHAEL E;ESHBACH JR JOHN R 发明人 BALMER RICHARD H.;LEE SHIH CHUNG;DAO DUNG V.;KNAFELC CHRISTOPHER R.;HARRINGTON HEATH E.;ANSPACH KEAN M.;BUCKWALTER MICHAEL E.;ESHBACH, JR. JOHN R.
分类号 B65D85/62;B65B5/10;B65B35/50;B65D5/00 主分类号 B65D85/62
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