发明名称 MOISTURE-CURABLE ADHESIVE COMPOSITION AND HOT WATER FLOOR HEATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable adhesive composition having effects of suppressing deterioration in heating piping made of a synthetic resin and a hot water floor heating structure with high durability. SOLUTION: The moisture-curable adhesive composition contains (A) a moisture-curable organic polymer, (B) a 6-hydroxychroman derivative represented by general formula (1), and (C) an ester plasticizer (wherein R<SP>1</SP>, R<SP>3</SP>, R<SP>4</SP>, R<SP>5</SP>, R<SP>6</SP>, R<SP>7</SP>, R<SP>8</SP>, and R<SP>9</SP>each independently denotes a hydrogen atom or a 1-20C alkyl group, R<SP>2</SP>denotes a hydrogen atom, a 1-20C alkyl group, or a 2-20C alkenyl group). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011038033(A) 申请公布日期 2011.02.24
申请号 JP20090188592 申请日期 2009.08.17
申请人 CEMEDINE CO LTD 发明人 NISHIMURA KANA;ABE HIDEYUKI
分类号 C09J201/00;C09J11/06;C09J143/04;C09J201/10;E04F15/18 主分类号 C09J201/00
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