| 摘要 |
PROBLEM TO BE SOLVED: To reduce a beam-to-beam difference in a multi-beam semiconductor laser device. SOLUTION: Auxiliary electrode patterns 13Sa and 13Sc are provided on a surface of a sub-mount 10 located in an optical path of backward light emitted from a laser chip 11. Accordingly, respective backward lights emitted from a plurality of light emission sections of the laser chip 11 are incident on a photodiode chip 14 independently from the surface condition of the sub-mount 10, thereby variations of current value caused by the surface condition of the sub-mount 10 is suppressed, and the current value can be monitored with high accuracy. COPYRIGHT: (C)2011,JPO&INPIT
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