| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer level package having a cylindrical capacitor, having a structure capable of increasing electrostatic capacity by employing a cylindrical capacitor structure, and to provide a method of fabricating the same. <P>SOLUTION: The wafer level package includes a wafer chip 102 having a bonding pad 104 formed thereon and an insulating layer 106 formed thereon and exposing the bonding pad 104, a rewiring layer 108 connected to the bonding pad 104 and extending to one side of the insulating layer 106, a cylindrical outer electrode 114b connected to the rewiring layer 108 and having a hollow therein, a cylindrical inner electrode 114a formed in the hollow so as to be separated from the outer electrode 114b, a dielectric layer 116 formed between the outer electrode 114b and the inner electrode 114a, and a resin sealing portion 118 formed on the insulating layer 106 to cover the rewiring layer 108, the inner electrode 114a, the outer electrode 114b and the dielectric layer 116 and having an open part 120a for exposing an upper surface of the inner electrode 114a. <P>COPYRIGHT: (C)2011,JPO&INPIT |
