| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip attaching apparatus and method of the same. <P>SOLUTION: This semiconductor chip attaching apparatus includes: a collet body comprising a pick-up pad and a pad support; a collet plate provided on the collet body, whose center part of the lower surface contacts with the upper surface of the pad support, and whose edge parts of the lower surface are kept a distance from the upper surface of the pad support; and a first piping passing through the collet plate and the collet body. Wherein, a second piping is provided in the edge parts of the collet plate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
