发明名称 Ceramic substrate and manufacturing method thereof
摘要 The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.
申请公布号 US2011042131(A1) 申请公布日期 2011.02.24
申请号 US20090588502 申请日期 2009.10.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD 发明人 SUNG JE HONG;KIM JIN WAUN;CHANG MYUNG WHUN
分类号 H05K1/11;H05K3/00 主分类号 H05K1/11
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