发明名称 |
Ceramic substrate and manufacturing method thereof |
摘要 |
The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.
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申请公布号 |
US2011042131(A1) |
申请公布日期 |
2011.02.24 |
申请号 |
US20090588502 |
申请日期 |
2009.10.16 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
SUNG JE HONG;KIM JIN WAUN;CHANG MYUNG WHUN |
分类号 |
H05K1/11;H05K3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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