发明名称 CONNECTION STRUCTURE OF DIELECTRIC WAVEGUIDE
摘要 <P>PROBLEM TO BE SOLVED: To obtain a connection structure of dielectric waveguides, which is easily manufactured, prevents radio waves from leaking between a first dielectric waveguide and a second dielectric waveguide, and is reduced in thickness. <P>SOLUTION: The connection structure includes a first substrate 1 having the first dielectric waveguide 4, a second substrate 2 opposing the first substrate 1, and a dielectric bonding layer 3 for bonding the first substrate 1 to the second substrate 2. The first substrate 1 has a first choke structure 5 including a first choke dielectric layer 11 superimposed on the dielectric bonding layer 3 side of the first dielectric waveguide 4, a first choke conductor layer 12 superimposed on the dielectric bonding layer 3 and having a first choke conductor removal part 12b formed thereon, and a conductor via 15 for a first choke tip wall away from the first choke conductor removal part 12b and forming a first choke passage 16 along the first dielectric waveguide 4 together with the first conductor layer 7 and the first choke conductor layer 12. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011040804(A) 申请公布日期 2011.02.24
申请号 JP20090183381 申请日期 2009.08.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAWARA YUKIHIRO;KATAYAMA AKIKO;YAMAGUCHI SATOSHI;YONEDA HISAFUMI
分类号 H01P1/04;H01P1/02;H01P3/12;H01P5/02 主分类号 H01P1/04
代理机构 代理人
主权项
地址