METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT, AND RADIO-CONTROLLED TIMEPIECE

摘要

PROBLEM TO BE SOLVED: To prevent discharge in anodic bonding to achieve stable anodic bonding between a base substrate and a bonding film.

SOLUTION: The method for manufacturing a package is provided with: an arrangement step where an inner surface of a lid board 50 is superimposed onto an inner surface of a base board 40, and an outer surface of the base board 40 is disposed on an electrode base section 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base section 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded. The anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void section 73 formed in the electrode base section 70.

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