| 摘要 |
Provided is a semiconductor module in which electrical connection between insulating circuit boards is achieved readily, and heat produced from a semiconductor chip can be radiated efficiently under suppression of warpage deformation, even though the semiconductor module has a structure with a plurality of insulating circuit boards. The semiconductor module comprises a plurality of insulating circuit boards 9, a resin frame body 5 having a crosspiece 5a being in contact with first outer edges of the insulating circuit boards 9 opposed to each other and a frame element 5c being in contact with second outer edges of the plurality of insulating circuit boards 9 except the first outer edges, a conductive component 7 striding over the crosspiece 5a to achieve the connection between the insulating circuit boards 9 electrically, and an upper lid 8 having a lid element 8c covering an opening disposed at an upper part of the resin frame body 5 and a partition 8b abutting on a part of the crosspiece 5a. |
