| 发明名称 |
High-performance semiconductor and method for installing same |
| 摘要 |
<p>The power semiconductor module has a base plate (1) and a power semiconductor circuit board (2) that is charged with power semiconductors and is attached on the base plate. An adapter is formed in segmented manner, where the adapter has a base part (7) facing the base plate and a top part facing a control circuit board (13). An independent claim is also included for a method for mounting a power semiconductor module.</p> |
| 申请公布号 |
EP2288246(A1) |
申请公布日期 |
2011.02.23 |
| 申请号 |
EP20100006523 |
申请日期 |
2010.06.23 |
| 申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
HUETTMEIER, SIMON;POPP, RAINER |
| 分类号 |
H05K7/14;H02M7/00 |
主分类号 |
H05K7/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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