Method and device for applying a covering to a card

摘要

The device has a heat radiation unit (120) comprising heat radiation sources and an infra red radiation source and heating an adhesive agent (116) by heat radiation (128). A pressure unit (102) connects a cover (114) and a card (K) by a pressure application and under utilization of the heated adhesive agent. The heat radiation unit is arranged outside of the pressure unit. The adhesive agent is arranged on the cover or the card, where the cover is arranged on a supporting substrate (112). A pressure application element (104) and a counter element (119) include a pair of mating rolls or belts. An independent claim is also included for a method for applying a cover on a section of a surface of a card.