| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a ceramic electronic component capable of effectively preventing a failure, such as deformation and cracks, from occurring in conductive and ceramic layers. <P>SOLUTION: The method for manufacturing the electronic component includes a step A for forming a conductor pattern 8 on a support sheet 6; a step B for forming the conductor pattern 8 and a dielectric layer 9 having nearly the same thickness as the conductor pattern 8 so that a substrate exposed between the conductor patterns is covered from one main surface side; a step C for arranging a film 11 having an adhesive pattern 12 or an adsorption pattern corresponding to the conductor pattern on a support sheet 6 so that the film 11 comes into contact with the dielectric layer 9, and separating the film 11 from the support sheet 6 to selectively remove a part on the conductor pattern 8 in the dielectric layer 9; a step D for forming a laminate 15 by laminating a plurality of composite layers comprising the conductor pattern 8 on the support sheet 6 and the remaining section of the dielectric layer 9; and a step E for obtaining a multilayer electronic component by heat-treating the laminate 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
