| 摘要 |
<p>The method involves applying a soldering paste layer (4) in an area of a rear side (2b) of a printed circuit board (2). A hole (2c) extending from a front side (2a) to the rear side of the board is annularly surrounded by the paste layer. The board is equipped with a nut (3) that includes an outer diameter at an end (3a), such that the end is arranged in the hole. The outer diameter is smaller than a diameter of the hole. A soldering connection is formed between the nut and the board by a reflow-soldering process. A connection end of an electrical component is positioned on the front side.</p> |
