METHOD OF DICING SOLAR CELL WAFER USING LASER BEAM AND APPARATUS USING THEREFOR

摘要

PURPOSE: A method of cutting a solar cell wafer using laser beam and an apparatus thereof are provided to minimize burr and debris which is attached to a wafer by repeatedly moving laser beam at high speed. CONSTITUTION: A single crystal silicon ingot of a rod type is slid into predetermined thickness(S210). The slid silicon plate is cut into a predetermined standard wafer by transferring laser beam along a predetermined cutting plane line(S220). Burr and debris attached to the cutting plane of a solar cell wafer by moving laser beam along a virtual line parallel with the predetermined cutting plane(S230).