| 摘要 |
A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: preparing a chip carrier comprising a carrier substrate, a P type electrode and an N type electrode, and arranging an LED chip onto the carrier substrate to electrically connect the LED chip with the P type electrode and the N type electrode; packaging the LED chip with a light-transmissible packaging gel and making the P type electrode and the N type electrode exposed to form a molded LED chip cell; preparing an arrangement carrier comprising a arrangement carrier substrate, a P type electrode plate and an N type electrode plate; forming an arrangement recess on the arrangement carrier substrate; and arranging the molded LED chip cell into the arrangement recess to make the P type electrode and the N type electrode electrically connect to the P type electrode plate and the N type electrode plate respectively.
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