发明名称 |
Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component |
摘要 |
A semiconductor device includes a bump electrode including a bump made of resin, a base layer disposed on the bump, and a conductive surface layer disposed on the base layer. The base layer has ductility lower than that of the conductive surface layer and includes base regions which are spaced from each other and which are arranged at least in a top zone of the bump electrode. |
申请公布号 |
US7893533(B2) |
申请公布日期 |
2011.02.22 |
申请号 |
US20070839572 |
申请日期 |
2007.08.16 |
申请人 |
EPSON IMAGING DEVICES CORPORATION |
发明人 |
SAITO ATSUSHI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|