POLISHING HEAD AND SUBSTRATE TREATING APPARATUS AND METHOD INCLUDING THE HEAD

摘要

PURPOSE: A polishing head, a substrate process apparatus including the same, and a method thereof are provided to uniformly polish the overall surface of the substrate by controlling the amount of polishing according to the polishing area of the substrate. CONSTITUTION: A spin head(110) supports a substrate(W). The spin head driver rotates the spin head using the electricity applied from the outside. A polishing head(310) polishes the substrate supported by the spin head. A polishing head supporting part(320) revolves along with the polishing head. A polishing head moveable member(330) transfers the torque generated by a driving part(340) to the grinding head support part.