| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive substrate, exhibiting high thermal conductivity and hence is capable of efficiently dissipating heat, even those with small area, and to provide a method of manufacturing the substrate. <P>SOLUTION: The thermally conductive substrate 100 is constituted to include a lower part heat-sink layer 110; a thermal conductor 121 formed in contact with the lower part heat sink layer 110; a thermally conductive layer 120, including an insulating adhesive part 122 to fill in between the thermal conductors 121; and an upper part layer 130 formed on the thermally conductive layer 120 and dissipating heat to the lower part heat sink layer 110 in contact with the thermal conductor 121. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
