| 摘要 |
Disclosed are a wafer-level lens module including a plurality of wafer-scale lenses that are stacked and an image pickup device including the wafer-level lens module and an image sensor. Each wafer-scale lens includes a substrate with a light-transmission part, and a lens element fixed on one side or both sides of the substrate. The lens element includes an optical zone, corresponding to the light-transmission part of the substrate, and an extended zone disposed outside the optical zone. A trench or protrusion is formed as an alignment guide on one or both sides of the substrate, adjacent to the light-transmission part, and a protrusion or trench, aligned with the trench or protrusion, is formed in the extended zone of the lens element. The lens element is aligned on the substrate such that an inclined portion of the protrusion contacts corners of the trench.
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