发明名称 METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
摘要 An emitter wrap-through solar cell may include a semiconductor substrate having a first side, and a second side opposite the first side, contact structures having at least one emitter contact, and at least one base contact, wherein both the at least one emitter contact and the at least one base contact are arranged on the second side of the semiconductor substrate, and the contact structures have a metallization having nickel silicide.
申请公布号 US2011036398(A1) 申请公布日期 2011.02.17
申请号 US20100839434 申请日期 2010.07.20
申请人 SOLARWORLD INNOVATIONS GMBH 发明人 BITNAR BERND;NEUHAUS HOLGER
分类号 H01L31/0224;H01L31/068;H01L31/18 主分类号 H01L31/0224
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