CONDUCTIVE ADHESIVE, SEMICONDUCTOR MOUNTING METHOD USING SAME, AND WAFER LEVEL PACKAGE

摘要

The present invention relates to an anisotropic conductive adhesive and to a semiconductor mounting method using same, as well as to a semiconductor level package. The adhesive comprises: a conductive paste including meltable conductive particles, an adhesive insulating resin that is not completely cured at the melting point of the conductive particles, and heat-resistant particles which do not melt at a temperature below which the adhesive insulating resin is completely cured; and an insulation layer including a meltable conductive layer, and an adhesive insulating resin that is not completely cured at the melting point of the conductive layer, wherein the conductive layer and the insulation layer selectively include heat-resistant particles that do not melt at a temperature below which the adhesive insulating resin is completely cured.