PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

摘要

Disclosed is a method for producing a high-density printed wiring board having a surface on which a high-precision and ultrafine copper circuit pattern is formed, which is comprised of (a) a process for forming a resist pattern (5) which is formed by selectively exposing and developing a photosensitive resist film formed on the substrate surface, to form a groove pattern for a circuit forming portion and which can be plated by electroless copper plating, (b) a process for forming a copper plating layer (7) which covers the resist pattern by plating an exposed surface of the groove pattern portion of a substrate and the entire surface of the patterned resist film by electroless copper plating and, thereafter, plating the surfaces by electrolytic copper plating until the surfaces are substantially flattened and smoothed, and (c) a process for exposing a copper circuit pattern (8) on the surface by mechanically grinding and/or chemically grinding or etching the copper plating layer to evenly reduce the copper plating layer until the surface of the resist film is exposed. It is preferable that the pattern-formed resist film is irradiated with ultraviolet rays, heat-treated and/or plasma-treated.