| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow electrical characteristic inspection for a semiconductor integrated circuit using a Kelvin contact method to be conducted in a pre-process without obstructing the reduction in size of a semiconductor chip nor complicating circuit design. <P>SOLUTION: A probe card in an inspection apparatus includes probe needles for Kelvin contacts each comprising a coil type probe needle and a pogo pin type probe needle disposed in the inside thereof, and a probe needle for two-terminal measurement. Electrode pads 2, 3 formed in each chip area 1A over a wafer are in a relation of A≤B<2A, when it is assumed that the area of the electrode pad 3 with which the probe needle for a Kelvin contact comes into contact and the area of the electrode pad 2 with which the probe needle for two-terminal measurement comes into contact are B and A, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT |
