SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to reduce cost required for manufacturing initial equipments by injecting a sealing material in a cavity and omitting the molding frame. CONSTITUTION: A first substrate(101) includes a circuit wiring with a bond finger. A second substrate(102) includes a cavity(160) exposing a part of the first substrate with the bond finger. Semiconductor chips(150a, 150b) are mounted on the first substrate which is exposed by the cavity. A connecting unit(116) electrically connects the bond finger and a bonding pad. A sealing material(190) seals hermetically the cavity with the semiconductor chips.