发明名称 |
Coolant cooled type semiconductor device |
摘要 |
A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules 1 are arranged in such a manner that main surface directions of these semiconductor modules 1 are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules 1 are sandwiched by coolant tube 2 having folded portions with fixing members 6, 7, 10. As a consequence, both surfaces of the semiconductor module 1 can be cooled by a single coolant tube with a uniform pinching force. <IMAGE> |
申请公布号 |
EP2234154(A3) |
申请公布日期 |
2011.02.16 |
申请号 |
EP20100006258 |
申请日期 |
2001.04.18 |
申请人 |
DENSO CORPORATION |
发明人 |
INOUE, SEIJI;OHKOUCHI, YASUYUKI |
分类号 |
H01L23/473;H01L23/40;H01L23/433;H01L23/498;H01L25/07;H01L25/11 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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