HOLE PLUGGING POLYMER WITH A STRONG HEAT RESISTANCE AND STABLE COEFFICENT OF THERMAL EXPANSION, RESIN COMPOSITION CONTAINING THE SAME, AND METHOD FOR HOLE PLUGGING USING THE SAME

摘要

PURPOSE: An epoxy resin composition for hole-plugging and a terminal diepoxy modified bismaleimide for the same are provided to ensure excellent thermal resistance and to simplify manufacturing process. CONSTITUTION: A terminal diepoxy modified bismaleimide has a structure of chemical formula 1. The viscosity of the terminal diepoxy modified bismaleimide is 5,000-30,000 cPs at 25°C. A method for preparing the terminal diepoxy modified bismaleimide comprises: a step of reacting bismaleimide compound of chemical formula 3 with acrylic acid to carboxylic group-substituted 5-4 membered fusion cyclic intermediate; and a step of reacting apoxide group of diepoxy compound of chemical formula 4 with the carboxy group of the fusion cyclic intermediate. The epoxy resin composition contains 4-8% of bisphenol type A, bisphenol type F or mixture thereof, 2-5% of novalac epoxy, 7-12% of aliphatic cyclic epoxy, 2-5% of imidazole latent hardener, and 0.1-0.5% of hardener.