CHIP CARRIER FOR A CHIP MODULE AND METHOD OF MANUFACTURING THE CHIP MODULE

摘要

The invention relates to a chip carrier for manufacturing a chip module (18), with a substrate and connection leads arranged on the substrate, wherein the connection leads are designed like stripes and extend parallel over the substrate, and wherein the connection leads consist of electrically conductive connection strands (12, 13) placed on the substrate, and the substrate is formed by a carrier film (11).