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发明名称
Interposer and semiconductor package using the same
摘要
申请公布号
KR101013558(B1)
申请公布日期
2011.02.14
申请号
KR20080110129
申请日期
2008.11.06
申请人
发明人
分类号
H01L23/12;H01L21/60
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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