发明名称 BARRIERE ETANCHE POUR MICROCOMPOSANT ET PROCEDE DE FABRICATION D'UNE TELLE BARRIERE.
摘要 <p>The method involves forming a fusible intercalary layer (18) between thin sealing layers (16, 20), and melting the intercalary layer, where the fusion temperature of the intercalary layer is lower than that of sealing layers. The intercalary layer is made of material selected from indium/tin, tin/bismuth, tin/lead/cadmium, indium/lead/silver, tin/lead, tin/lead/antimony, gold/tin, lead/tin/gold or bismuth/cadmium/lead/tin alloy. An independent claim is also included for a sealed barrier for a microcomponent, comprising a stack of two thin sealing layers.</p>
申请公布号 FR2941563(B1) 申请公布日期 2011.02.11
申请号 FR20090050437 申请日期 2009.01.26
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 SANCHETTE FREDERIC;DUCROS CEDRIC;MARTIN STEVE
分类号 H01L23/29;H01L31/0203 主分类号 H01L23/29
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