| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which absorbs the processing variations of components and brings a heat dissipating block into pressure contact at a proper pressure with a heat dissipating surface of an apparatus body to offer a sufficient cooling effect. SOLUTION: The electronic apparatus includes a CPU 12 disposed on a drawer 8 pushed in and pulled out of the apparatus body 1 freely, a heat receiving block 13 of a heat pipe 15 overlaid on the CPU 12 and the heat dissipating block 16 fixed to the heat receiving block 13 via pipes 17a and 17b, a support mechanism 11 supporting the heat receiving block of the heat pipe 15 to allow the heat receiving block to move freely, and a heat receiving plate 21a which makes up part of the apparatus body 1 and with which the heat dissipating block 16 is brought in pressure contact in an action interlocking with the drawer 8 being pushed into the apparatus body 1. In an action interlocking with the heat dissipating block 16 of the heat pipe 15 being brought in pressure contact with the heat receiving plate 21a of the apparatus body 1, the heat receiving block is moved, after which the drawer 8 and the heat dissipating block 16 are fixed and held to the apparatus body 1. COPYRIGHT: (C)2011,JPO&INPIT |
