| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing containing no halogen and no antimony, having a thermal expansion coefficient near to that of a lead frame even when a ratio of a filler is high, excellent solder reflow resistance by an elastic modulus reducing effect during high temperature and excellent thermal shock resistance and containing no sulfur having possibility of copper corrosion and to provide an electronic component device provided with an element sealed by the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing contains (A) an epoxy resin, (B) a curing agent and (C) a trimellitic acid ester. The electronic component device is provided with the element sealed by the epoxy resin composition. COPYRIGHT: (C)2011,JPO&INPIT
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