| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device of manufacturing a substrate for a power module that can securely bond a metal plate and a ceramics substrate, suppress formation of a brazing material bump to eliminate the need for an operation to remove the brazing material bump, prevent the ceramics substrate from being broken in the operation to remove the brazing material bump, and achieve precise processing, and to provide a manufacture intermediate. SOLUTION: In the method of manufacturing the substrate for the power module including a bonding process of brazing the metal plate 30 to a top surface of the ceramics substrate 20 by heating a stack 50 formed by stacking the substantially rectangular ceramics substrate 20, the substantially rectangular metal plate 30 and brazing filler metal 40 between a pair of pressure plates 60, a flank 63 of predetermined width that leaves the stack 50 is provided on a top surface of at least one of the pressure plate 60 along two sizes forming one corner part 61. In the bonding process, a brazing material pool space 52 is formed between the top surface of the stack 50 and the flank 63. COPYRIGHT: (C)2011,JPO&INPIT
|
