SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package which can be thinned and suppress bending in a manufacturing process, and a method of manufacturing the same.

SOLUTION: A semiconductor package 100 can comprise an insulator 120 having first and second opening portions 121, 122; an active element 140 disposed inside the first opening portion 121; a passive element 130 disposed inside the second opening portion 122; a protection member 110 which is disposed in a lower part of the insulator 120 and covers a lower part of the passive element 130; a build-up layer 150 disposed on the insulator 120 and electrically connected with the active element 140, and an external connection means 180 electrically connected with the build-up layer 150. A heat dissipation member 300 can be attached to a lower surface of the active element 140.

COPYRIGHT: (C)2011,JPO&INPIT