| 摘要 |
PROBLEM TO BE SOLVED: To excellently connect plugs which are stacked to each other. SOLUTION: A method for manufacturing a semiconductor device includes: forming a first interlayer insulating film on a semiconductor substrate; forming a first hole in the first interlayer insulating film; forming a barrier film inside the first hole; filling a conductive material in the first hole to form a first plug; forming a second interlayer insulating film on the first interlayer insulating film; forming a second hole reaching the first plug in the second interlayer insulating film; selectively etching the upper end of the barrier film inside the second hole; and forming a second plug for connection to the first plug inside the second hole. COPYRIGHT: (C)2011,JPO&INPIT |
