| 摘要 |
PROBLEM TO BE SOLVED: To reduce a manufacturing cost, miniaturize a device, save a space, and enhance workability. SOLUTION: A wafer prober includes a tray which supports a wafer at a set position, carries it to a processing position of the wafer and is placed at the processing position, one or more alignment units which position the wafer at the set position with respect to the tray, contact units arranged more than the alignment units for performing inspection processing in contact with the wafer at the processing position, and a tray carrier for carrying the tray supporting the wafer between the alignment unit and the contact unit. The tray includes three or more pin holes for allowing movement of the chuck pin in the XYZθdirections, an alignment mark for positioning the wafer, and an alignment unit for positioning the tray itself. COPYRIGHT: (C)2011,JPO&INPIT |
