发明名称 LASER SCRIBE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser scribing method which is used for machining a hard brittle material such as sapphire. <P>SOLUTION: The invented laser scribing method is used for forming a crack in a workpiece to be machined along a scribing direction by means of a light source which emits a laser beam and an irradiation optical system which guides the laser beam to the workpiece to be machined. The method comprises an emission step, a separation step, a light condensing step, and an irradiation step. In the emission step, the laser beam is emitted from the light source. In the separation step, the laser beam is separated into an ordinary ray component and an extraordinary ray component which are different in the traveling direction. In the light condensing step, the ordinary ray component and the extraordinary ray component are condensed to form a plurality of pairs of beam spots. In the irradiation step, the workpiece to be machined is intermittently irradiated in the scribing direction with the laser beam having the plurality of pairs of beam spots. A birefringent prism provided in the irradiation optical system may be used for the separation of the laser beam into the ordinary ray component and the extraordinary ray component in the separation step. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011025304(A) 申请公布日期 2011.02.10
申请号 JP20090176462 申请日期 2009.07.29
申请人 SEISHIN SHOJI KK 发明人 KAJIKAWA TOSHIKAZU
分类号 B23K26/00;B23K26/06;B23K26/067;C03B33/09 主分类号 B23K26/00
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