| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which responds to a demand for improvement in electric reliability. SOLUTION: The wiring board 3 includes: a base 7 formed by laminating a plurality of resin layers 10; and conductive layers 15 formed on upper and lower surfaces of the base 7 and at least overlap with each other in a vertical direction. Resin layers 10 positioned between the overlapping conductive layers 15 include a plurality of resin layers 10a containing a filler 13 and a second resin layer 10b which is interposed between adjacent first resin layer 10a and does not contain the filler 13. COPYRIGHT: (C)2011,JPO&INPIT |
