| 摘要 |
In one embodiment, a method for cleaning a substrate in a cleaning module is disclosed. The method includes an operation that receives the substrate into a first level of the cleaning module. In another operation, the substrate is spun while contemporaneously applying a cleaning fluid to top and bottom surfaces of the substrate. In yet another operation, the substrate is spun at a second level of the cleaning module. The method also includes an operation to dry the substrate in an enclosed cavity at a third level of the cleaning module.
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