| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate polishing apparatus and method which have improved polishing efficiency and can prevent the breakage of the substrate during a polishing process. <P>SOLUTION: The substrate polishing apparatus includes a polishing unit and a pad supporting member. The polishing unit includes a polishing pad for polishing a substrate seated on a substrate supporting member, and a pad driving member for moving the polishing pad. The pad supporting member is disposed at a side of the substrate supporting member so as to support a portion of a polishing surface of the polishing pad, which is not brought into contact with the substrate, when an edge of the substrate seated on the substrate supporting member is polished. Consequently, the substrate polishing apparatus prevents the polishing pad from being inclined to the outer side of the substrate while the edge of the substrate is polished. <P>COPYRIGHT: (C)2011,JPO&INPIT |
