| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board for effectively using a metallic body immediately under a bonding pad. SOLUTION: A flexible printed wiring board 14 is provided with an insulator layer 1, conductor wiring 9 formed on one surface of the insulator layer 1, and a bonding pad 22 constituted by including at least a portion of the conductor wiring 9 and connected to a semiconductor element 16 mounted to one surface via a bonding wire 17 and a metallic body 7 for bonding packed in a hole put through the insulator layer 1 immediately under the bonding pad 22. COPYRIGHT: (C)2011,JPO&INPIT
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