| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip such that positional information in a process of manufacturing the semiconductor chip can be traced by effectively utilizing a dicing region without sacrificing the device region of the semiconductor chip, to provide a method of manufacturing the semiconductor chip, and to provide a semiconductor wafer. SOLUTION: The semiconductor chip includes semiconductor element portions which are formed on the surface of the semiconductor wafer through the process of manufacturing a semiconductor and separated by cutting individually defined dicing regions 24, and identification parts 27 which are provided to a part other than the semiconductor element portions, left in outer peripheral regions of the individual semiconductor element portions even after the dicing regions are cut, and composed of at least one or more recessed or projection parts for identifying the semiconductor element portions individually. COPYRIGHT: (C)2011,JPO&INPIT |
