| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board in which impedance matching can be improved. SOLUTION: On the upper surface of the base film 2 of the flexible wiring board, a signal line 3 and a ground line 4 are formed. On the lower surface of the base film 2, a shield layer 5 is formed. On the base film 2, oblong holes 21, 22 and 23 which are the holes passing through the base film 2 and extending along the ground line 4 are formed. The ground line 4 and the shield layer 5 are conducted through conductor parts 51, 52 and 53 formed inside the oblong holes 21, 22 and 23 so as to extend along the ground line 4. COPYRIGHT: (C)2011,JPO&INPIT
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