发明名称 |
COMPOUND LIFT PIN TIP WITH TEMPERATURE COMPENSATED ATTACHMENT FEATURE |
摘要 |
A method and apparatus for a lift pin is described. In one embodiment, a lift pin head is described. The lift pin head includes a base member having a body made of a first material having a first coefficient of thermal expansion, and a tip disposed on the base member, the base member having a body made of a second material that is flexible at room temperature and having a second coefficient of thermal expansion, the first coefficient of thermal expansion being less than the second coefficient of thermal expansion. |
申请公布号 |
WO2011017226(A2) |
申请公布日期 |
2011.02.10 |
申请号 |
WO2010US43956 |
申请日期 |
2010.07.30 |
申请人 |
APPLIED MATERIALS, INC.;POLYAK, ALEXANDER S.;CHO, TOM K.;GOMEZ, OSCAR |
发明人 |
POLYAK, ALEXANDER S.;CHO, TOM K.;GOMEZ, OSCAR |
分类号 |
H01L21/68;G02F1/13;H01L21/683 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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