| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet attaching apparatus and a sheet attaching method that are capable of attaching an adhesive sheet onto the entire inner surface of a recessed portion of a plate-like member, which has a projecting portion around the recessed portion, without leaving any unattached area. SOLUTION: The sheet attaching apparatus 10 attaches an adhesive sheet S onto a recessed portion 12 of a semiconductor wafer W which has a ring-like projecting portion 11 at its periphery around the recessed portion 12. The apparatus includes a table 15 that supports the semiconductor wafer W and a pressing means 16 that presses the adhesive sheet S against the recessed portion 12. The pressing means 16 includes an elastic sheet 23 consisting of a bottom lid section 23A and a cylindrical section 23B, and an elastic ring 24 disposed on the periphery side of the cylindrical section 23B. Pressurizing a pressurization chamber C causes the bottom lid section 23A to press the adhesive sheet S against the bottom surface of the recessed portion 12 while causing the cylindrical section 23B and the elastic ring 24 to press the adhesive sheet S against the side surface of the recessed portion 12. COPYRIGHT: (C)2011,JPO&INPIT |
